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A Smart Procedure for the Femtosecond Laser-Based Fabrication of a Polymeric Lab-on-a-Chip for Capturing Article

Annalisa Volpe, Udith Krishnan, Maria Serena Chiriacò, Elisabetta Primiceri, Antonio Ancona, Francesco Ferrara

Engineering 2021, Volume 7, Issue 10,   Pages 1436-1442 doi: 10.1016/j.eng.2020.10.012

Abstract: The entire platform was realized in polymethyl methacrylate (PMMA), combining femtosecond (fs) laser

Keywords： Lab-on-a-chip     Fs laser     Circulating tumor cells     Point of care     Thermal bonding     Polymers    

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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2,   Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, andbonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors.then Si-Au alloy bonding was formed by annealing at 400vH for 2 h.The air sealability of the cavity after bonding was finally tested using the N filling method.The results indicate that large bond strength was obtained at the bonding interface.

Keywords： Si/Au-glass     strength     MEMS packaging     process     sandwich structure    

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Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Frontiers of Mechanical Engineering 2010, Volume 5, Issue 1,   Pages 87-92 doi: 10.1007/s11465-009-0078-x

Abstract: the traditional wet chemical activation processes, is applied to enhance hydrophilic silicon direct bondingThe effects of UV exposure on silicon wafers’ nano-topography and bonding strength are studied.The correlations of annealing temperature and annealing time vs. bonding strength are experimentallyResults indicate that the bonding strength increases sharply then gently with increasing annealing temperatureIt follows from the results that the bonding strength of silicon wafer pairs with UV exposure decreases

Keywords： ultraviolet (UV) exposure     silicon direct bonding     bonding strength     reliability    

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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2,   Pages 214-218 doi: 10.1007/s11465-011-0130-5

Abstract:

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasappropriate pre-drying temperature (60°C), and predrying time (6 min), we obtained the intermediate layer bondingExperimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturehas advantages of easy operation, low cost, and no plugging or leakage in the patterned area after bondingPatterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic

Keywords： ultraviolet (UV) adhesive     intermediate layer     patterned wafer bonding    

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A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 3,   Pages 360-363 doi: 10.1007/s11465-006-0027-x

Abstract: A space solar cell bonding robot system which consists of a three-axis Cartesian coordinate s robot,coating device, bonding device, orientation plate, and control subsystem was studied.

Keywords： Cartesian coordinate     thickness     three-axis Cartesian     orientation     control subsystem    

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Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Strategic Study of CAE 2014, Volume 16, Issue 4,   Pages 40-44

Abstract:

The starch- based aqueous polymer isocycante（API）gluelam bonding as theresearch object，with tensile shear strength as a key evaluation index，accelerated aging tests on gluelam bondingto study damage mode and failure mechanism of the bonding The results show that：the adhesive fractureproperties of ductile fracture structure，and with the increase of aging time，the damage mode of the bonding

Keywords： bonding structure     accelerated aging     fracture character     damage mode    

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Development of Laser Cutting and Joining Processing

Chen Li, Gong Shuili, He Enguang

Strategic Study of CAE 2020, Volume 22, Issue 3,   Pages 78-84 doi: 10.15302/J-SSCAE-2020.03.012

Abstract:

Laser cutting and joining technology is indispensable as an advancedbe surely promoted by the integration of laser technology and digital manufacturing technology.joining and cutting technology, namely, laser welding, laser cutting, laser drilling, and laser markingThe problems faced by the development of the laser joining and cutting technology are discussed.unit, laser materials processing, and intelligent integration.

Keywords： laser material processing     laser welding     laser cutting     laser drilling     laser marking    

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Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Frontiers of Chemical Science and Engineering 2017, Volume 11, Issue 3,   Pages 465-482 doi: 10.1007/s11705-017-1641-3

Abstract: For more than six decades, chromic acid anodizing (CAA) has been the central process in the surface pre-treatment of aluminum for adhesively bonded aircraft structures. Unfortunately, this electrolyte contains hexavalent chromium (Cr(VI)), a compound known for its toxicity and carcinogenic properties. To comply with the new strict international regulations, the Cr(VI)-era will soon have to come to an end. Anodizing aluminum in acid electrolytes produces a self-ordered porous oxide layer. Although different acids can be used to create this type of structure, the excellent adhesion and corrosion resistance that is currently achieved by the complete Cr(VI)-based process is not easily matched. This paper provides a critical overview and appraisal of proposed alternatives to CAA, including combinations of multiple anodizing steps, pre- and post anodizing treatments. The work is presented in terms of the modifications to the oxide properties, such as morphological features (e.g., pore size, barrier layer thickness) and surface chemistry, in order to evaluate the link between fundamental principles of adhesion and bond performance.

Keywords： aluminum     Cr(VI)-free     surface pre-treatments     anodizing     adhesive bonding    

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Temperature field simulation of laser homogenizing equipment

Juanjuan WANG, Yunshan WANG, Fudong ZHU

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 1,   Pages 49-52 doi: 10.1007/s11465-009-0005-1

Abstract: The laser homogenizing equipment was devised using the ring scanning principle.A laser scanning ring facula is obtained when the laser beam goes through the equipment’s optical systemhardness layer and better process quality can be attained using the ring facula optimized for metal laser

Keywords： laser homogenizing technology     laser scanning ring facula     temperature field    

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ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 2,   Pages 134-146 doi: 10.1007/s11465-009-0033-x

Abstract: When welding steel with aluminum, the appearance of intermetallic compounds of Fe and Al will decrease tenacity and increase rigidity, which leads to bad joint performance. A new type of low energy input (LEI) welding technology is introduced which can be used to weld steel with aluminum. Using the technology, brazing was located on the steel side and arc fusion welding on the aluminum side. The less heat input reduces the thickness of intermetallic compounds to 3-4 μm. Tensile strength tests prove that the joint breaks at the heat-affected zone and the strength is higher than 70% of the aluminum’s. Thus, the method can lead to a good performance joint.

Keywords： joining of steel and aluminum     low energy input welding     arc welding     fusion welding – brazing    

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Strategic Research on China’s Laser Technology and Its Application by 2035

Research Group of Strategic Research on China’s Laser Technology and Its Application by 2035

Strategic Study of CAE 2020, Volume 22, Issue 3,   Pages 1-6 doi: 10.15302/J-SSCAE-2020.03.001

Abstract:

To promote the development of laser technology and its application, theAcademy of Engineering launched a major consulting project “Strategic Research on China’s LaserIt briefly analyzes laser technology and its instrumental, leading, and disruptive role in scientificinnovation ecology of laser industry.cultivation of the laser and optical disciplines.

Keywords： laser technology，laser manufacturing，laser communication，laser diagnosis and treatment    

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Processing parameter optimization of fiber laser beam welding using an ensemble of metamodels and MOABC

Frontiers of Mechanical Engineering 2022, Volume 17, Issue 4, doi: 10.1007/s11465-022-0703-5

Abstract: In fiber laser beam welding (LBW), the selection of optimal processing parameters is challenging andEM constructs the correlation between processing parameters (laser power, welding speed, and distance

Keywords： laser beam welding     parameter optimization     metamodel     multi-objective    

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Development of lunar regolith composite and structure via laser-assisted sintering

Frontiers of Mechanical Engineering doi: 10.1007/s11465-021-0662-2

Abstract: In this paper, a laser-assisted additive manufacturing process is developed to fabricate lunar regolithcombination of composite material compositions and process parameters are mixing ratio of 50/50 in volume, laserThereafter, the mechanical properties of laser-sintered lunar regolith composites are implemented toThe effectiveness and the feasibility of this laser-assisted process are potentially developed for future

Keywords： in situ manufacturing     laser-assisted powder fusion process     mechanical properties     topological    

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Development of Laser Surface Modification Technology

Zhang Qunli, Wang Liang, Mei Xuesong, Yao Jianhua

Strategic Study of CAE 2020, Volume 22, Issue 3,   Pages 71-77 doi: 10.15302/J-SSCAE-2020.03.010

Abstract:

The laser surface modification technology uses high-energy-density laserAfter decades of development, laser surface modification technology has been widely applied to aerospaceTaking three typical laser surface modification technologies—laser shock processing, laser quenchingsurface modification, on-site laser remanufacturing, laser shock processing with controlled shape andperformance, intelligent laser surface modification, and laser surface micro-structure preparation.

Keywords： laser surface modification     laser shock processing     laser quenching     laser cladding     development trend    

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Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Strategic Study of CAE 2002, Volume 4, Issue 6,   Pages 56-62

Abstract: It is based on bulk silicon bonding technology and film sealed technology.The bulk silicon bonding technology includes electrostatic bonding, silicon direct bonding and interfaciallayer assisted bonding.

Keywords： packaging of MEMS     bulk silicon bonding technology     film-sealed technology    

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Title Author Date Type Operation

A Smart Procedure for the Femtosecond Laser-Based Fabrication of a Polymeric Lab-on-a-Chip for Capturing

Annalisa Volpe, Udith Krishnan, Maria Serena Chiriacò, Elisabetta Primiceri, Antonio Ancona, Francesco Ferrara

Journal Article

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Journal Article

Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Journal Article

Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Journal Article

A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Journal Article

Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Journal Article

Development of Laser Cutting and Joining Processing

Chen Li, Gong Shuili, He Enguang

Journal Article

Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Journal Article

Temperature field simulation of laser homogenizing equipment

Juanjuan WANG, Yunshan WANG, Fudong ZHU

Journal Article

ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Journal Article

Strategic Research on China’s Laser Technology and Its Application by 2035

Research Group of Strategic Research on China’s Laser Technology and Its Application by 2035

Journal Article

Processing parameter optimization of fiber laser beam welding using an ensemble of metamodels and MOABC

Journal Article

Development of lunar regolith composite and structure via laser-assisted sintering

Journal Article

Development of Laser Surface Modification Technology

Zhang Qunli, Wang Liang, Mei Xuesong, Yao Jianhua

Journal Article

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Journal Article